Samsung to more than double HBM4 output next year, glass carrier volume up 2.5x

Samsung is expected to more than double output of its HBM4 and HBM4E DRAM

Samsung plans to boost HBM4 and HBM4E monthly wafer input from 180K to 250K next year, more than doubling output. Outsourced glass carrier cleaning volume jumps from 20K to 50K sheets per month—critical for preventing warpage in high-stack chips. HBM4 family share of total HBM shipments rises from 40% to 80%, centered on 12+ layer stacks. Samsung started HBM4 mass shipments in February and provided 12-layer HBM4E samples to Nvidia in May. The post doesn't disclose specific customer order volumes or pricing.